PCB
PCB design is a critical part of the design of electronics products and includes PCB routing and component placement layout
Stand PCB
Here at Bester, Standard PCB service refers to full feature printed circuit board manufacturing service. With 10+ years’ experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate materials including FR4, Aluminum, Rogers, etc. This page only touches standard FR4 based PCB. For PCBs with special technical substrate, please refer to corresponding webpages for information.
Features
It is recommended to use rigid PCB service when your design is ready to transform from prototype phase to production phase. We can manufacture up to 1 million pieces high-quality PCBs in as short as 2 days. To endow your project with expected function and more possibilities, we offer advanced features for rigid PCB services. Comprehensive capabilities can be found in the following table:
| Feature | Capabilities |
|---|---|
| Quality Grade | Standard IPC 2 |
| Number of Layers | 1 – 32layers |
| Order Quantity | 1pc – 10,000,000 pcs |
| Build Time | 2days – 5weeks |
| Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Board Size | Min 6mm x 6mm Max 600mm x 700mm |
| Board Thickness | 0.4mm – 3.2mm |
| Copper Weight | 0.5oz – 6.0oz |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS |
| Min Annular Ring | 3mil |
| Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
| Min Width of Cutout (NPTH) | 0.8mm |
| Min Width of Slot Hole (PTH) | 0.6mm |
| Surface/Hole Plating Thickness | 20μm – 30μm |
| Aspect Ratio | 1:10 (hole size: board thickness) |
| Test | 10V – 250V, flying probe or testing fixture |
| Impedance tolerance | ±5% – ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Chamfer of Gold Fingers | 20, 30, 45, 60 |
| Other Techniques | Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |
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